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【作者】
集成电路测试仪器与装备产业技术创新联盟是在集成电路产业技术创新战略联盟领导下，在科技部指导下，于2016年12月24日由我国从事集成电路检测与测试技术相关的产学研用单位在完全自愿的基础上发起成立。联盟秘书处依托中国科学院微电子研究所，遵守各项法规、保障公平、公正、可持续发展，属于非排他性的、开放的非营利性创新组织。联盟秉承"开放、协作、分享、共赢”的宗旨，以我国集成电路测试产业未来发展的关键技术与重大科学仪器产品需求为牵引，依托联盟各成员单位的人才、技术和市场资源，加强信息交流共享、开展国内国际合作、整合测试产业资源、突出联盟整体优势、提升联盟成员作用，同时在政府和会员单位之间发挥桥梁和纽带作用，共同推动我国集成电路测试仪器和装备的技术创新和产业化，并为国际集成电路测试技术发展做出贡献。
【内容】
集成电路测试设备与检测仪器是集成电路产业技术研发及生产中不可缺的核心设备。在我国集成电路发展的这些年中，该领域的发展一直没有得到应有的重视，全行业发展处于摸索阶段，甚至一些领域仍然是空白。随着工艺技术的快速发展，测试设备/检测仪器的总投入规模已经达到整个晶圆制造工厂设备总投资规模的30%以上。随着工艺节点的更新，其技术的需求将面临更大的挑战。本书面向中国集成电路测试与检测产业链的技术创新趋势，在借鉴国际测试技术发展路线图的同时，以国内检测与测试产业链为主要对象，针对性的提出了国内集成电路测试产业链技术创新发展路线。全书共6章，从5个方面分析了国内测试产业实现产业技术链创新和赶超国际产业的主要方向，包括集成电路检测、自动化测试ATE和电力电子测试技术与产品，另外还有测试服务和军民融合技术；对正在不断涌现的新领域进行了简要分析；*后对封装测试的市场格局发展进行总结，推动我们集成电路产业赢得更快更好的发展。
【目录】
第一章 集成电路工艺品质控制检测技术与产品.........................................1
一、集成电路产业中的工艺品质控制概况··················································1
（一）集成电路产业链与工艺品质控制检测布局································1
（二）工艺品质控制检测技术和设备发展趋势····································2
（三）工艺品质控制检测设备市场整体情况········································4
二、硅制程（前道）中的关键工艺品质控制检测技术与设备··················4
（一）图形化表面检测技术与设备························································7
（二）无图形表面检测技术与设备······················································20
（三）光刻套刻对准测量技术与设备··················································23
（四）其他分析及检测技术与设备······················································25
（五）前道制程中的工艺品质控制检测的整体发展趋势··················26
三、晶圆级封装（中道）中的关键工艺品质控制检测技术与设备········29
（一）三维表面形貌测量技术与设备··················································30
（二）自动光学检测技术与设备（中道）··········································35
（三）无图形表面检测技术与设备······················································37
（四）中道制程中的工艺品质控制检测的整体发展趋势··················37
四、基板与传统封装测试（后道）中的关键工艺品质控制检测技术
与设备····································································································38
（一）自动光学检测技术与设备（后道）········································· 38
（二）自动X 射线检测技术与设备···················································· 41
（三）后道制程中的工艺品质控制检测的整体发展趋势················· 42
第二章 自动化测试设备技术与产品......................................................... 43
一、芯片/模组测试市场需求及发展趋势·················································· 43
（一）电源管理类芯片的测试需求及趋势········································· 47
（二）CIS 芯片的测试需求及趋势······················································ 47
（三）逻辑/混合信号芯片的测试需求及趋势···································· 49
（四）存储器芯片的测试需求及趋势················································· 52
（五）LCD Driver芯片的测试需求及趋势········································· 54
二、ATE 自动测试机械手的现状及发展方向··········································· 57
三、模拟及电源管理芯片ATE 设备发展现状及趋势······························ 59
四、逻辑/混合信号ATE 测试系统的发展现状及趋势····························· 60
五、存储器ATE 测试系统的发展现状及趋势·········································· 62
六、LCD Driver 测试系统的发展现状及趋势··········································· 63
七、其他定制化专用集成电路测试设备发展的方向及趋势··················· 65
八、SLT 测试技术的特点及行业发展前景··············································· 67
九、指纹芯片/模组的测试发展趋势·························································· 69
十、MEMS芯片的测试发展趋势······························································ 71
十一、与芯片可测性设计结合的ATE 设备一体化方案路线·················· 73
第三章 测试服务...................................................................................... 75
一、测试服务——平台技术······································································· 77
（一）整体技术需求············································································· 77
（二）发展趋势····················································································· 77
（三）重点方向····················································································· 78
二、测试服务——共性技术······································································· 81
（一）整体技术需求············································································· 81
（二）重点方向····················································································· 82
（三）发展趋势····················································································· 84
三、测试服务——产品测试解决方案························································84
（一）先进工艺IP 核测试解决方案····················································85
（二）先进封装测试解决方案······························································87
（三）先进核心产品测试解决方案······················································90
第四章 军用与民用集成电路测试差异性研究与技术发展....................... 102
一、整体技术需求······················································································102
二、发展趋势······························································································103
三、重点方向······························································································105
（一）宽温测试技术············································································105
（二）抗辐照测试技术········································································107
（三）电磁环境效应测试技术···············································
一、集成电路产业中的工艺品质控制概况··················································1
（一）集成电路产业链与工艺品质控制检测布局································1
（二）工艺品质控制检测技术和设备发展趋势····································2
（三）工艺品质控制检测设备市场整体情况········································4
二、硅制程（前道）中的关键工艺品质控制检测技术与设备··················4
（一）图形化表面检测技术与设备························································7
（二）无图形表面检测技术与设备······················································20
（三）光刻套刻对准测量技术与设备··················································23
（四）其他分析及检测技术与设备······················································25
（五）前道制程中的工艺品质控制检测的整体发展趋势··················26
三、晶圆级封装（中道）中的关键工艺品质控制检测技术与设备········29
（一）三维表面形貌测量技术与设备··················································30
（二）自动光学检测技术与设备（中道）··········································35
（三）无图形表面检测技术与设备······················································37
（四）中道制程中的工艺品质控制检测的整体发展趋势··················37
四、基板与传统封装测试（后道）中的关键工艺品质控制检测技术
与设备····································································································38
（一）自动光学检测技术与设备（后道）········································· 38
（二）自动X 射线检测技术与设备···················································· 41
（三）后道制程中的工艺品质控制检测的整体发展趋势················· 42
第二章 自动化测试设备技术与产品......................................................... 43
一、芯片/模组测试市场需求及发展趋势·················································· 43
（一）电源管理类芯片的测试需求及趋势········································· 47
（二）CIS 芯片的测试需求及趋势······················································ 47
（三）逻辑/混合信号芯片的测试需求及趋势···································· 49
（四）存储器芯片的测试需求及趋势················································· 52
（五）LCD Driver芯片的测试需求及趋势········································· 54
二、ATE 自动测试机械手的现状及发展方向··········································· 57
三、模拟及电源管理芯片ATE 设备发展现状及趋势······························ 59
四、逻辑/混合信号ATE 测试系统的发展现状及趋势····························· 60
五、存储器ATE 测试系统的发展现状及趋势·········································· 62
六、LCD Driver 测试系统的发展现状及趋势··········································· 63
七、其他定制化专用集成电路测试设备发展的方向及趋势··················· 65
八、SLT 测试技术的特点及行业发展前景··············································· 67
九、指纹芯片/模组的测试发展趋势·························································· 69
十、MEMS芯片的测试发展趋势······························································ 71
十一、与芯片可测性设计结合的ATE 设备一体化方案路线·················· 73
第三章 测试服务...................................................................................... 75
一、测试服务——平台技术······································································· 77
（一）整体技术需求············································································· 77
（二）发展趋势····················································································· 77
（三）重点方向····················································································· 78
二、测试服务——共性技术······································································· 81
（一）整体技术需求············································································· 81
（二）重点方向····················································································· 82
（三）发展趋势····················································································· 84
三、测试服务——产品测试解决方案························································84
（一）先进工艺IP 核测试解决方案····················································85
（二）先进封装测试解决方案······························································87
（三）先进核心产品测试解决方案······················································90
第四章 军用与民用集成电路测试差异性研究与技术发展....................... 102
一、整体技术需求······················································································102
二、发展趋势······························································································103
三、重点方向······························································································105
（一）宽温测试技术············································································105
（二）抗辐照测试技术········································································107
（三）电磁环境效应测试技术···············································
【书摘插画】
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